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Normas IEC internacionales electrotécnicas - AENOR
IEC PAS 62174:2000

IEC PAS 62174:2000

Resistance to soldering temperature for through-hole mounted devices

Date:
2000-08-22 /Anulada
Idiomas Disponibles:
Inglés
Summary (English):
Determines whether solid state devices can withstand the effects of the temperature to which they will be subjected during soldering of their leads. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.
Summary (French):
Relationship with other IEC standards
20,88
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