IEC PAS 62174:2000

Resistance to soldering temperature for through-hole mounted devices

Information:

Date:

2000-08-22 /Anulada

Idiomas Disponibles:

Inglés

Summary (English):

Determines whether solid state devices can withstand the effects of the temperature to which they will be subjected during soldering of their leads. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.

Summary (French):

Relationship with other IEC standards

Es reemplazada por: IEC 60749-15:2003

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