IEC 60749-22:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Corrigendum 1 - Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 22: Robustesse des contacts soudés

Date:

2003-08-13 /Vigente

Idiomas Disponibles:

Bilingüe

Summary (English):

Summary (French):

Relationship with other IEC standards

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